ECIA EIA-747-C PDF

ECIA EIA-747-C PDF

Name:
ECIA EIA-747-C PDF

Published Date:
05/01/2020

Status:
[ Active ]

Description:

Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick

Publisher:
Electronic Components Industry Association

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$25.5
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ANSI APPROVED

This Standard covers requirements for 8mm, 12mm, 16mm and 24mm taping of surface mount components generally less than 1.0mm thick and requiring high precision taping for automatic handling of devices such as singulated bare die and other surface mount components. Refer to EIA-481 for the current Industry Standard for 8mm and 12 mm punched and 8mm to 24mm embossed taping requirements.


ANSI : ANSI Approved
Edition : C
File Size : 0 files
Number of Pages : 17
Published : 05/01/2020

History

ECIA EIA-747-C
Published Date: 05/01/2020
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick
$25.5
ECIA EIA-747-B
Published Date: 02/01/2014
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick
$2.1
ECIA EIA/ECA-747-A
Published Date: 02/01/2007
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
$2.7
ECIA EIA-747
Published Date: 06/01/2002
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
$2.1
ECIA EIA/IS-747
Published Date: 12/01/1997
Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
$1.2

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