ECIA EIA-800 PDF

Name:
ECIA EIA-800 PDF

Published Date:
03/01/1999

Status:
[ Stabilized ]

Description:

Integrated Passive Device (IPD) Chipscale Package Design Guidelines

Publisher:
Electronic Components Industry Association

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Introduction

This guideline is intended to facilitate a common industry direction with regard to IPD chipscale packaging. This guideline is not intended to document special product designs that are supplier–customer unique.

Edition :	99
File Size :	0 files
Number of Pages :	11
Published :	03/01/1999

History

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ECIA EIA-800 PDF

Integrated Passive Device (IPD) Chipscale Package Design Guidelines

History

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