ECIA IS-759 PDF

Description

This specification defines the qualification program for surface mount multilayer chip inductors. The qualification program is defined in table 1. Specification sheet can be added, as required, to define specific products or to cover unique/specific requirements. This document does not relieve the supplier of their responsibility to their own company’s internal qualification program.

Preconditioning

This process is intended to simulate exposure to the thermal and cleaning environments of the assembly process before qualification testing. The component assembly process simulation requirements for different types of process are described in annex A.