ECIA J-STD-002C PDF

This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization. This standard is intended for use by both vendor and user.

Purpose

Solderability evaluations are made to verify that the solderability of component leads and terminations meets the requirements established in this standard and to determine that storage has had no adverse effect on the ability to solder components to an interconnecting substrate. Determination of solderability can be made at the time of manufacture, at receipt of the components by the user, or just before assembly and soldering.

The resistance to dissolution of metallization determination is made to verify that metallized terminations will remain intact throughout the assembly soldering processes.

Shall and Should The word "shall" is used in the text of this document wherever there is a requirement for materials, preparation, process control or acceptance of a soldered connection or a test method. The word "should" reflects recommendations and is used to reflect general industry practices and procedures for guidance only.

Document Hierarchy In the event of conflict, the following decreasing order of precedence applies:

1. Procurement as agreed between user and supplier.

2. Master drawing or master assembly drawing reflecting the user's detailed requirements.

3. When invoked by the customer or per contractual agreement, this document, J-STD-002.

4. Other documents to extent specified by the customer.