Name:
MEMS Packaging PDF
Published Date:
01/01/2004
Status:
[ Active ]
Publisher:
Institution of Engineering and Technology
The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aerospace application.
| Edition : | 04 |
| File Size : | 1 file , 2.2 MB |
| Number of Pages : | 307 |
| Published : | 01/01/2004 |
