Name:
Silicon Wafer Bonding Technology for VLSI and MEMS Applications PDF
Published Date:
01/01/2002
Status:
[ Active ]
Publisher:
Institution of Engineering and Technology
The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process.
Authors
A. J. Auberton-Hervé and S. S. Iyer
| Edition : | 02 |
| File Size : | 1 file , 15 MB |
| Number of Pages : | 177 |
| Published : | 01/01/2002 |
