ESD JS-001-2023 PDF

This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

All packaged semiconductor devices, thin film circuits, acoustic wave devices, optoelectronic devices, hybrid integrated circuits (HICs), discrete, and multi-chip modules (MCMs) containing any of these devices as well as unpackaged singulated bare die, and die which are still part of a wafer are to be evaluated according to this standard.