ESD SP5.0-2023 PDF

This document applies to ESD withstand level information in datasheets or other information publications such as reliability or qualification reports. All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) should have this information provided.

NOTE: This document does not apply to electrically initiated explosive devices, flammable liquids, or powders.