ESD SP5.3.4-2022 PDF

This document establishes a procedure for testing components and microcircuits, such as integrated circuits, discrete semiconductor components, and electronic modules containing more than a single component, according to its susceptibility (sensitivity) to damage or degradation by exposure to a defined contact CDM like electrostatic discharge (ESD). This contact-based test method can be performed on packaged devices as well as on bare dies and wafers.