ETSI TS 100 543 PDF

Published Date: 08/01/1999

Digital cellular telecommunications system (Phase 2+) (GSM); Call Forwarding (CF) supplementary services; Stage 2 (GSM 03.82 version 7.0.0 Release 1998)

Published Date: 07/01/1999

Digital cellular telecommunications system (Phase 2+) (GSM); Call Forwarding (CF) supplementary services; Stage 2 (GSM 03.82 version 6.1.0 Release 1997)

Published Date: 04/01/1999

Digital cellular telecommunications system (Phase 2+) (GSM); Call Forwarding (CF) supplementary services; Stage 2 (GSM 03.82 version 6.0.0 Release 1997)

Published Date: 01/01/2021

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; 5G; Non-Access-Stratum (NAS) functions related to Mobile Station (MS) in idle mode (3GPP TS 23.122 version 16.8.0 Release 16)

Published Date: 01/01/2021

Universal Mobile Telecommunications System (UMTS); LTE; 5G; 3GPP Evolved Packet System (EPS); Evolved General Packet Radio Service (GPRS) Tunnelling Protocol for Control plane (GTPv2-C); Stage 3 (3GPP TS 29.274 version 16.6.0 Release 16)

Published Date: 08/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 1: UEA2 and UIA2 specifications (3GPP TS 35.215 version 16.0.0 Release 16)

Published Date: 08/01/2020

LTE; Telecommunication management; Configuration Management (CM) for mobile networks that include virtualized network functions; Requirements (3GPP TS 28.510 version 16.0.0 Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage