ETSI TS 103 544-17 PDF

Published Date: 10/01/2019

Publicly Available Specification (PAS); Intelligent Transport Systems (ITS); MirrorLink(R); Part 17: MirrorLink(R) over Wi-Fi Display (WFD)

Published Date: 10/01/2017

Publicly Available Specification (PAS); Intelligent Transport Systems (ITS); Part 17: MirrorLink over Wi-Fi Display (WFD)

Published Date: 01/01/1992

Integrated Services Digital Network (ISDN); Connected Line Identification Presentation (COLP) supplementary service; Service description

Published Date: 07/01/2018

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; IP Multimedia Services Identity Module (ISIM) Application Programming Interface (API); ISIM API for Java Card TM (3GPP TS 31.133 version 15.0.0 Release 15)

Published Date: 12/01/2020

Smart Cards; Secured packet structure for UICC based applications (Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage