ETSI TS 129 120 PDF

Published Date: 07/01/2020

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR) (3GPP TS 29.120 version 16.0.0 Release 16)

Published Date: 07/01/2018

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR) (3GPP TS 29.120 version 15.0.0 Release 15)

Published Date: 04/01/2017

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR) (3GPP TS 29.120 version 14.0.0 Release 14)

Published Date: 10/01/2012

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR) (3GPP TS 29.120 version 11.0.0 Release 11)

Published Date: 05/01/2011

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR) (3GPP TS 29.120 version 10.0.0 Release 10)

Published Date: 01/01/2010

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR) (3GPP TS 29.120 version 9.0.0 Release 9)

Published Date: 01/01/2009

Universal Mobile Telecommunications System (UMTS); LTE; Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3GPP TS 29.120 version 8.0.0 Release 8)

Published Date: 06/01/2007

Universal Mobile Telecommunications System (UMTS); Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3GPP TS 29.120 version 7.0.0 Release 7)

Published Date: 12/01/2004

Universal Mobile Telecommunications System (UMTS); Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3GPP TS 29.120 version 6.0.0 Release 6)

Published Date: 08/01/2002

Universal Mobile Telecommunications System (UMTS); Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3GPP TS 29.120 version 4.0.0 Release 4)

Published Date: 06/01/2002

Universal Mobile Telecommunications System (UMTS); Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3GPP TS 29.120 version 5.0.0 Release 5)

Published Date: 09/01/2000

Universal Mobile Telecommunications System (UMTS); Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3GPP TS 29.120 version 3.1.0 Release 1999)

Published Date: 03/01/2000

Universal Mobile Telecommunications System (UMTS); Mobile Application Part (MAP) specification for Gateway Location Register (GLR); Stage 3 (3G TS 29.120 version 3.0.0 Release 1999)

Published Date: 11/01/2020

LTE; Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment (UE) conformance specification; Radio transmission and reception; Part 2: Implementation Conformance Statement (ICS) (3GPP TS 36.521-2 version 16.6.0 Release 16)

Published Date: 01/01/2021

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; 5G; Mobile Application Part (MAP) specification (3GPP TS 29.002 version 16.1.0 Release 16)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage