ETSI TS 135 217 PDF

Published Date: 08/01/2020

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 16.0.0 Release 16)

Published Date: 07/01/2018

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 15.0.0 Release 15)

Published Date: 04/01/2017

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 14.0.0 Release 14)

Published Date: 02/01/2013

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 11.1.0 Release 11)

Published Date: 02/01/2013

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 10.1.0 Release 10)

Published Date: 02/01/2013

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 9.1.0 Release 9)

Published Date: 02/01/2013

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 8.1.0 Release 8)

Published Date: 02/01/2013

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); LTE; Specification of the 3GPP Confidentiality and Integrity Algorithms UEA2 & UIA2; Document 3: Implementors' test data (3GPP TS 35.217 version 7.1.0 Release 7)

Published Date: 06/01/2018

Digital cellular telecommunications system (Phase 2+) (GSM); Universal Mobile Telecommunications System (UMTS); LTE; Quality of Service (QoS) concept and architecture (3GPP TS 23.107 version 15.0.0 Release 15)

Published Date: 09/01/2020

Universal Mobile Telecommunications System (UMTS); Interlayer procedures in Connected Mode (3GPP TS 25.303 version 16.0.0 Release 16)

Published Date: 02/01/2011

ERM; System Reference Document; Short Range Devices; Tech characteristics for SRD equipment using Ultra Wide Band Sensor technology; Part 5: Loc tracking apps type 2 operating in the frequency bands from 3,4 GHz to 4,8 GHz & from 6 GHz to 8,5 GHz for person & object tracking & industrial apps

Published Date: 03/31/2010

Digital cellular telecommunications system (Phase 2+); Universal Mobile Telecommunications System (UMTS); Telecommunication management; Entry Point (EP) Integration Reference Point (IRP); eXtensible Markup Language (XML) definitions (3GPP TS 32.365 version 9.0.1 Release 9)

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage