FORD WSD-M8A20-A1 PDF

FORD WSD-M8A20-A1 PDF

Name:
FORD WSD-M8A20-A1 PDF

Published Date:
10/10/2003

Status:
[ Inactive ]

Description:

BEARINGS - LEAD BRONZE STEEL BACKED ***TO BE USED WITH FORD WSS-M99P1111-A***

Publisher:
Ford Motor Company

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$9
Need Help?
REPLACES S-M8A1004-A

1. SCOPE

The materials defined by these specifications are medium leaded Bronze bearing alloys bonded to a low carbon steel backing.


Edition : 03
File Size : 1 file , 59 KB
Number of Pages : 3
Published : 10/10/2003

History

FORD WSD-M8A20-A1
Published Date: 10/10/2003
BEARINGS - LEAD BRONZE STEEL BACKED ***TO BE USED WITH FORD WSS-M99P1111-A***
$9
FORD WSD-M8A20-A1
Published Date: 03/04/1993
BEARINGS - LEAD BRONZE STEEL BACKED
$9

Related products

FORD WSS-M3H115-B
Published Date: 06/11/2019
CARPET, BCF NYLON 6/6, CUT PILE, LANIER PATTERN, 407 g/m2 (12 oz), TUFTED FLOOR BACKING ***TO BE USED WITH FORD WSS-M99P1111-A***
$9
FORD WSE-M99C122-A2
Published Date: 11/17/2009
LUBRICANT, DRY FILM, COATING, FREON FREE ***TO BE USED WITH FORD WSS-M99P1111-A***
$9
FORD M14J200-A
Published Date: 09/01/1991
AROMATIC HYDROCARBON THINNERS
$9
FORD SK-M3G9506-B
Published Date: 11/30/1994
TAPE, PVC-FOAM CLOSED CELL, PRESSURE SENSITIVE, APPROVED MINIMUM THICKNESS FOR FLAMMABILITY 8,0MM
$9

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1