FORD WSK-M2D398-A PDF

Name:
FORD WSK-M2D398-A PDF

Published Date:
05/25/2010

Status:
[ Inactive ]

Description:

POLYURETHANE (PUR) FOAM, MOLDED, INTEGRAL SKIN TO BE USED WITH FORD WSS-M99P1111-A

Publisher:
Ford Motor Company

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

INACTIVE FOR NEW DESIGN

The material defined by this specification is a low density molded polyurethane foam with a high density integral skin.

Edition :	10
File Size :	1 file , 22 KB
Number of Pages :	2
Published :	05/25/2010

History

FORD WSK-M2D398-A

Published Date: 05/25/2010

POLYURETHANE (PUR) FOAM, MOLDED, INTEGRAL SKIN ***TO BE USED WITH FORD WSS-M99P1111-A***

FORD WSK-M2D398-A

Published Date: 09/16/2004

POLYURETHANE (PUR) FOAM, MOLDED, INTEGRAL SKIN ***TO BE USED WITH FORD WSS-M99P1111-A***

FORD WSK-M2D398-A

Published Date: 11/02/1994

POLYURETHANE (PUR) FOAM, MOLDED, INTEGRAL SKIN

Related products

FORD WSS-M4D649-A4

Published Date: 03/01/2011

POLYETHYLENE (PE) FOAM, CHEMICALLY CROSSLINKED, CLOSED CELL ***TO BE USED WITH FORD WSS-M99P1111-A***

FORD WSB-M4D900-A

Published Date: 01/20/2010

POLYPHENYLENE SULFIDE (PPS), 45% MINERAL MOLDING COMPOUND ***TO BE USED WITH FORD WSS-M99P1111-A***

FORD U-ZB014

Published Date: 11/01/1995

FRAME ASSY

FORD ESB-M4D233-C

Published Date: 07/28/2009

POLYVINYL CHLORIDE COPOLYMER FOAM - HIGH DENSITY ***TO BE USED WITH FORD WSS-M99P1111-A***

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004

Published Date: 09/20/2004

Letter symbols to be used in electrical technology - Control technology

$12.6

IEC/PAS 60050-732 Ed. 1.0 b:2007

Published Date: 06/06/2007

International Electrotechnical Vocabulary - Part 732: Computer network technology

$61.2

IEC/PAS 60092-510 Ed. 1.0 en:2009

Published Date: 04/29/2009

Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems

$89.7

IEC/PAS 60099-7 Ed. 1.0 en:2004

Published Date: 04/27/2004

Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341

$95.1

IEC/PAS 60191-6-18 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

$29.1

IEC/PAS 60191-6-19 Ed. 1.0 en:2008

Published Date: 01/22/2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

$32.1