GMKOREA EDS-M-6228 PDF

GMKOREA EDS-M-6228 PDF

Name:
GMKOREA EDS-M-6228 PDF

Published Date:
10/27/2006

Status:
[ Revised ]

Description:

FLOOR MAT

Publisher:
GM DAEWOO AUTO AND TECHNOLOGY COMPANY

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$23.4
Need Help?
ENGLISH

This specification applies to the floor mat.

PURPOSE

This specification specifies the requirement of basic property for patterns and qualities of floor mat used in interior material of automobile.


Edition : 1
File Size : 1 file , 24 KB
Number of Pages : 4
Published : 10/27/2006

History

GMKOREA EDS-M-6228
Published Date: 09/01/2010
FLOOR MAT
$12.9
GMKOREA EDS-M-6228
Published Date: 10/27/2006
FLOOR MAT
$23.4

Related products

GMKOREA EDS-T-7665
Published Date: 06/19/2006
가스켓 재질의 압축율과 회복율 시험방법
$23.4
GMKOREA EDS-M-6660
Published Date: 06/01/2011
Energy Absorbing Foam
$12.9
GMKOREA EDS-T-7405
Published Date: 05/01/2012
Determination of Ozone Resistance of Elastomer
$12.9
GMKOREA EDS-M-1507
Published Date: 02/26/2003
리벳용 원형강
$23.4

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1