GMKOREA EDS-T-3221 PDF

GMKOREA EDS-T-3221 PDF

Name:
GMKOREA EDS-T-3221 PDF

Published Date:
10/15/2008

Status:
[ Not for New Design ]

Description:

후드 굽힘 강성 시험 절차

Publisher:
GM DAEWOO AUTO AND TECHNOLOGY COMPANY

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$12.9
Need Help?
VERSION 3

본 시험 표준은 승용차(PASSENGER CAR & MULTI PURPOSE VEHICLE)중에서 가스 스프링(GAS SPRING) 이 장착된 후드에 한하여 적용한다.

목적

실차 사용중의 정확한 장착 (FITTING)을 보증하기 위하여, 후드(HOOD) 굽힘 강성(BENDING STIFFNESS)을 결정하기 위한 것이다.


Edition : 08
File Size : 1 file , 140 KB
Number of Pages : 5
Published : 10/15/2008

History


Related products

GMKOREA EDS-M-3302
Published Date: 04/01/2011
Black Oxidation Finishes on Steels
$12.9
GMKOREA EDS-T-7423
Published Date: 06/01/2012
Cold Resistance of Elastomers
$12.9
GMKOREA EDS-M-8510
Published Date: 07/04/2006
PVC - SEALING ADHESIVE
$23.4
GMKOREA EDS-M-6607
Published Date: 06/24/2003
직물 섬유를 기본 소재로 성형으로 만든 화이버 매트
$23.4

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1