GMKOREA EDS-T-3225 PDF

GMKOREA EDS-T-3225 PDF

Name:
GMKOREA EDS-T-3225 PDF

Published Date:
02/01/2012

Status:
[ Inactive ]

Description:

Test Procedure of BIW Jack Point

Publisher:
GM DAEWOO AUTO AND TECHNOLOGY COMPANY

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Czech version):
200 business days

SKU:
gmkorea-eds-t-3225_2600190

Choose Document Language:
0
Need Help?
ENGLISH/KOREAN

B.I.W. jack point of passenger cars and multi-purposed passenger cars. Matters other than those defined in this standard will be pursuant to the regulations of drawings.

PURPOSE

This standard defines the test procedure and specifications for evaluation of rigidity characteristics of B.I.W. jack joint panel when replacing tires with new ones by making use of a jack on an actual car.


Edition : 2
Number of Pages : 1
Published : 02/01/2012

History

GMKOREA EDS-T-3225
Published Date: 02/01/2012
Test Procedure of BIW Jack Point
GMKOREA EDS-T-3225
Published Date: 06/19/2006
TEST PROCEDURE OF B.I.W. JACK POINT
23.40 €

Related products

GMKOREA EDS-T-7543
Published Date: 12/01/2010
Test Method for Thermal Analysis of Plastics
23.40 €
GMKOREA EDS-M-4403
Published Date: 05/16/2003
폴리비닐클로라이드 - SHORE A 70
23.40 €
GMKOREA EDS-M-1807
Published Date: 12/01/2010
Stainless Steel Wires
23.40 €
GMKOREA EDS-M-2106
Published Date: 04/01/2011
Aluminum and Aluminum Alloy Extruded Shape
12.90 €

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
12.60 €
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
61.20 €
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
89.70 €
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
95.10 €
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
29.10 €
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
32.10 €