Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. GMNA
  3. GMNA 9985259 PDF

GMNA 9985259 PDF

GMNA 9985259 PDF

Name:
GMNA 9985259 PDF

Published Date:
08/01/2002

Status:
[ Inactive ]

Description:

Compound - Adhesive Sealant, Anaerobic, Grade 259

Publisher:
General Motors North America

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$23.4
Need Help?
ENGLISH * INAC NO S/S

1 Scope This specification is inactive with no replacement.


Edition : C
File Size : 1 file , 5.8 KB
Number of Pages : 1
Published : 08/01/2002

History

Related products

GMNA GM1721M
GMNA GM1721M
Published Date: 12/01/1977
Cement, Trim, Sprayable
$23.4
GMNA 9986534
GMNA 9986534
Published Date: 01/01/2024
Dexcool 40/60 Premix Coolant
$12.9
GMNA 9981973
GMNA 9981973
Published Date: 01/01/1990
Solder Dust Washer Compound
$23.4
GMNA 9984249
GMNA 9984249
Published Date: 12/01/2022
Sealer - Pumpable, Non-Appearance Paintable, Ultralight, Low Bake

Best-Selling Products

IEC/PAS 60027-6 Ed. 1.0 en:2004
IEC/PAS 60027-6 Ed. 1.0 en:2004
Published Date: 09/20/2004
Letter symbols to be used in electrical technology - Control technology
$12.6
IEC/PAS 60050-732 Ed. 1.0 b:2007
IEC/PAS 60050-732 Ed. 1.0 b:2007
Published Date: 06/06/2007
International Electrotechnical Vocabulary - Part 732: Computer network technology
$61.2
IEC/PAS 60092-510 Ed. 1.0 en:2009
IEC/PAS 60092-510 Ed. 1.0 en:2009
Published Date: 04/29/2009
Electrical installations in ships - Part 510: Special features - High-voltage shore connection systems
$89.7
IEC/PAS 60099-7 Ed. 1.0 en:2004
IEC/PAS 60099-7 Ed. 1.0 en:2004
Published Date: 04/27/2004
Surge arresters - Part 7: Glossary of terms and definitions from IEC publications 60099-1, 60099-4, 60099-6, 61643-1, 61643-12, 61643-21, 61643-311, 61643-321, 61643-331 and 61643-341
$95.1
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
$29.1
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
IEC/PAS 60191-6-19 Ed. 1.0 en:2008
Published Date: 01/22/2008
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
$32.1