GMW GMW16195 PDF

Note: Nothing in this standard supercedes applicable laws and regulations.

Note: In the event of conflict between the English and domestic language, the English language shall take precedence.

This specification covers the durability and adhesion performance requirements for curing structural bonding tapes.

Material Description. Heat curable structural bonding tape with integrated pressure sensitive adhesive. The tape is typically protected with a suitable release liner. Type I tape is intended for medium/high bake plants. Type II tape is intended for low bake plants. Contact engineering for specific plant bake schedules.

Symbols. Not applicable.

Typical Applications. This adhesive material is used primarily for the attachment of roof ditch molding clips to roof ditches. Other applications can include the attachment of appliqués, or other trim parts.

Remarks. This specification covers the laboratory test requirements for GM Approved Adhesive Applications (AAA), Production Part Approval Process (PPAP), processing conditions and routine quality control. In regions other than GMNA, the AAA process is optional.

In addition to the substrate/adhesive/substrate combinations, approvals are also specific to the facility that does the adhesive bonding.