GMW GMW18629 PDF

This specification covers the requirements for a high bake conductive, sealing, primer for use over Sheet Molding Compound (SMC) and rigid plastics with a paint bake latitude of approximately (115 to 135) °C ((240 to 275) °F). The primer shall provide a smooth, adhesion promoting, conductive surface for electrostatic application of subsequent coatings. The primer shall be sandable, have the ability to fill minor surface imperfections in the substrate, and act as a barrier to prevent popping of topcoats during subsequent bakes. It shall also provide ultraviolet (UV) protection to any underlying coatings and the substrate.

Note: Nothing in this standard supercedes applicable laws and regulations.

Note: In the event of conflict between the English and domestic language, the English language shall take precedence.

Purpose/Material Description.

This primer is part of the total painted product system and shall provide a smooth, adhesion-promoting coating direct to substrate or in-mold coating and to subsequent coatings.

Qualified to this Material Specification.

This primer is part of a total painted product system and shall meet requirements set forth in the specifications for other materials with which it is used. This specification shall be used in conjunction with the Approved Paint on Plastics System (APOPS), a section of the GM Materials Approved Source List (GMMASL), which lists approved substrate, cleaning, priming, and topcoat combinations. APOPS test requirements are defined in GMW14797.

Symbols.

Not applicable.

Applicability.

Primers covered under this specification are typically applied to SMC and rigid plastic substrates with a paint bake latitude of approximately (115 to 135) °C ((240 to 275) °F). Primers are used under an approved topcoat system.

Remarks.

None.