BS IEC 62899-202-7:2021 PDF

This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.

All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 850 KB
ISBN(s) :	9780580520037
Number of Pages :	16
Product Code(s) :	30369152, 30369152, 30369152
Published :	03/11/2021