BS IEC 63011-2:2018 PDF

BS IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.


Cross References:
IEC 63011-1
IEC 63011-3


All current amendments available at time of purchase are included with the purchase of this document.

File Size :	1 file , 1 MB
ISBN(s) :	9780580973758
Number of Pages :	16
Product Code(s) :	30355727, 30355727, 30355727
Published :	01/24/2019