Low prices! Originals & Translations! Save your budget and time!
ONLINENORMS: Online Standards Store
Click View Shopping Cart
  1. Home
  2. IEC
  3. IEC 60068-2-58 Ed. 3.0 b:2004 PDF

IEC 60068-2-58 Ed. 3.0 b:2004 PDF

IEC 60068-2-58 Ed. 3.0 b:2004 PDF

Name:
IEC 60068-2-58 Ed. 3.0 b:2004 PDF

Published Date:
07/15/2004

Status:
[ Withdrawn ]

Description:

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$61.8
Need Help?
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.
Edition : 3.0
File Size : 1 file , 1.3 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 53
Published : 07/15/2004

History

IEC 60068-2-58 Ed. 4.1 en:2017
IEC 60068-2-58 Ed. 4.1 en:2017
Published Date: 07/28/2017
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) CONSOLIDATED EDITION
$121.5
IEC 60068-2-58 Ed. 3.0 b:2005
IEC 60068-2-58 Ed. 3.0 b:2005
Published Date: 02/23/2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
$38.4
IEC 60068-2-58 Ed. 3.0 b:2004
IEC 60068-2-58 Ed. 3.0 b:2004
Published Date: 07/15/2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
$61.8

Related products

IEC 60068-2-29 Ed. 2.0 b:1987
IEC 60068-2-29 Ed. 2.0 b:1987
Published Date: 03/30/1987
Environmental testing. Part 2: Tests. Test Eb and guidance: Bump
$19.8
IEC 61207-3 Ed. 3.0 b:2019
IEC 61207-3 Ed. 3.0 b:2019
Published Date: 06/26/2019
Gas Analyzers - Expression of performance - Part 3: Paramagnetic oxygen analysers
$70.2
IEC 60068-3-1 Ed. 3.0 b:2023
IEC 60068-3-1 Ed. 3.0 b:2023
Published Date: 06/01/2023
Environmental testing - Part 3-1: Supporting documentation and guidance - Cold and dry heat tests
$28.5

Best-Selling Products

ASQ/ISO 14001-1996
ASQ/ISO 14001-1996
Published Date: 09/23/1996
Environmental Management Systems - Specifications with Guidance for Use
$15
ASQ/ISO 14001:2004
ASQ/ISO 14001:2004
Published Date: 11/01/2004
Environmental Management Systems - Specifications with Guidance for Use
$41.7
ASQ/ISO 14004-1996
ASQ/ISO 14004-1996
Published Date: 09/23/1996
Environmental Management Systems--General Guidelines on Principles, Systems, and Supporting Techniques
$18
ASQ/ISO 14004:2004
ASQ/ISO 14004:2004
Published Date: 01/10/2005
Environmental Management Systems--General Guidelines on Principles, Systems, and Supporting Techniques
$53.7
ASQ/ISO 14020-2001
ASQ/ISO 14020-2001
Published Date: 08/03/2001
Environmental labels and declarations - General principles
$18
ASQ/ISO 14021-2001
ASQ/ISO 14021-2001
Published Date: 08/03/2001
Environmental labels and declarations - Self-declared environmental claims (Type 2 Environmental labeling)
$28.5