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IEC 60068-2-83 Ed. 1.0 b:2011 PDF

IEC 60068-2-83 Ed. 1.0 b:2011 PDF

Name:
IEC 60068-2-83 Ed. 1.0 b:2011 PDF

Published Date:
09/07/2011

Status:
Active

Description:

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$83.4
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IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
Edition : 1.0
File Size : 1 file , 900 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 76
Published : 09/07/2011

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