Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Edition :	7.0
File Size :	1 file , 4.4 MB
ISBN(s) :	9782832258996
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	84
Published :	11/01/2022

IEC 60286-3 Ed. 7.0 b:2022 PDF

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

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