Name:
IEC 60286-3 Ed. 7.0 b:2022 PDF
Published Date:
11/01/2022
Status:
Active
Publisher:
International Electrotechnical Commission
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
| Edition : | 7.0 |
| File Size : | 1 file , 4.4 MB |
| ISBN(s) : | 9782832258996 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 84 |
| Published : | 11/01/2022 |
