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IEC 60749-21 Ed. 1.0 b:2004 PDF

IEC 60749-21 Ed. 1.0 b:2004 PDF

Name:
IEC 60749-21 Ed. 1.0 b:2004 PDF

Published Date:
03/15/2004

Status:
[ Withdrawn ]

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
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Choose Document Language:
$33
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Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
Edition : 1.0
File Size : 1 file , 850 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 45
Published : 03/15/2004

History

IEC 60749-21 Ed. 2.0 b:2011
IEC 60749-21 Ed. 2.0 b:2011
Published Date: 04/07/2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
$57
IEC 60749-21 Ed. 1.0 b:2005
IEC 60749-21 Ed. 1.0 b:2005
Published Date: 10/17/2005
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
$32.1
IEC 60749-21 Ed. 1.0 b:2004
IEC 60749-21 Ed. 1.0 b:2004
Published Date: 03/15/2004
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
$33

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