IEC 60749-22 Ed. 1.0 b:2002 PDF

Name:
IEC 60749-22 Ed. 1.0 b:2002 PDF

Published Date:
09/12/2002

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Edition :	1.0
File Size :	1 file , 720 KB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	41
Published :	09/12/2002

History

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IEC 60749-22 Ed. 1.0 b:2002 PDF

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

History

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