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IEC 60749-37 Ed. 1.0 b:2008 PDF

IEC 60749-37 Ed. 1.0 b:2008 PDF

Name:
IEC 60749-37 Ed. 1.0 b:2008 PDF

Published Date:
01/30/2008

Status:
Active

Description:

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$39.9
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Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Edition : 1.0
File Size : 1 file , 1 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 39
Published : 01/30/2008

History

IEC 60749-37 Ed. 2.0 b:2022
IEC 60749-37 Ed. 2.0 b:2022
Published Date: 10/01/2022
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
$57
IEC 60749-37 Ed. 1.0 b:2008
IEC 60749-37 Ed. 1.0 b:2008
Published Date: 01/30/2008
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
$39.9

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