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IEC 61188-5-1 Ed. 1.0 b:2002 PDF

IEC 61188-5-1 Ed. 1.0 b:2002 PDF

Name:
IEC 61188-5-1 Ed. 1.0 b:2002 PDF

Published Date:
07/12/2002

Status:
[ Withdrawn ]

Description:

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$117.6
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Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
Edition : 1.0
File Size : 1 file , 6.2 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 141
Published : 07/12/2002

History

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