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IEC 61188-5-4 Ed. 1.0 en:2007 PDF

IEC 61188-5-4 Ed. 1.0 en:2007 PDF

Name:
IEC 61188-5-4 Ed. 1.0 en:2007 PDF

Published Date:
10/30/2007

Status:
Active

Description:

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$12.3
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Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
Edition : 1.0
File Size : 1 file , 840 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 15
Published : 10/30/2007

History

IEC 61188-5-4 Ed. 1.0 b:2007
IEC 61188-5-4 Ed. 1.0 b:2007
Published Date: 10/30/2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
$28.5
IEC 61188-5-4 Ed. 1.0 en:2007
IEC 61188-5-4 Ed. 1.0 en:2007
Published Date: 10/30/2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
$12.3

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