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IEC 61188-5-8 Ed. 1.0 b:2007 PDF

IEC 61188-5-8 Ed. 1.0 b:2007 PDF

Name:
IEC 61188-5-8 Ed. 1.0 b:2007 PDF

Published Date:
10/30/2007

Status:
Active

Description:

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$70.2
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IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.
Edition : 1.0
File Size : 1 file , 1.3 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 61
Published : 10/30/2007

History

IEC 61188-5-8 Ed. 1.0 b:2007
IEC 61188-5-8 Ed. 1.0 b:2007
Published Date: 10/30/2007
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
$70.2
IEC 61188-5-8 Ed. 1.0 en:2007
IEC 61188-5-8 Ed. 1.0 en:2007
Published Date: 10/30/2007
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
$23.1

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