Name:
IEC 61189-2-804 Ed. 1.0 b:2023 PDF
Published Date:
08/01/2023
Status:
Active
Publisher:
International Electrotechnical Commission
This part of IEC 61189 specifies a test method to determine the time to delamination of base
materials and printed boards using a thermomechanical analyser (TMA). Temperatures used
for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
| Edition : | 1.0 |
| File Size : | 1 file , 700 KB |
| ISBN(s) : | 9782832274224 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 20 |
| Published : | 08/01/2023 |
