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IEC 61189-5-601 Ed. 1.0 b:2021 PDF

IEC 61189-5-601 Ed. 1.0 b:2021 PDF

Name:
IEC 61189-5-601 Ed. 1.0 b:2021 PDF

Published Date:
02/03/2021

Status:
Active

Description:

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$83.4
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IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
Edition : 1.0
File Size : 1 file , 3.3 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 80
Published : 02/03/2021

History

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