IEC 61709 Ed. 1.0 b:1996 PDF

IEC 61709 Ed. 1.0 b:1996 PDF

Name:
IEC 61709 Ed. 1.0 b:1996 PDF

Published Date:
10/17/1996

Status:
[ Withdrawn ]

Description:

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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Choose Document Language:
$55.2
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Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
Edition : 1.0
File Size : 1 file , 750 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 83
Published : 10/17/1996

History

IEC 61709 Ed. 3.0 b:2017
Published Date: 02/01/2017
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
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IEC 61709 Ed. 2.0 b:2011
Published Date: 06/24/2011
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
$112.5
IEC 61709 Ed. 1.0 b:1996
Published Date: 10/17/1996
Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion
$55.2

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