IEC 61837-2:2018(E) deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
a. revision of the figures to match the notation of the drawings of IEC 61240:2016;
b. addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
| Edition : | 3.0 |
| File Size : | 1
file
, 1.5 MB |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 99 |
| Published : | 05/08/2018 |
