IEC 62047-10 Ed. 1.0 b:2011 PDF

IEC 62047-10 Ed. 1.0 b:2011 PDF

Name:
IEC 62047-10 Ed. 1.0 b:2011 PDF

Published Date:
07/26/2011

Status:
Active

Description:

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$15.3
Need Help?
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.
Edition : 1.0
File Size : 1 file , 350 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 22
Published : 07/26/2011

History


Related products

IEC 60747-16-3 Ed. 1.2 b:2017
Published Date: 08/16/2019
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters CONSOLIDATED EDITION
$121.5
IEC 60747-15 Ed. 3.0 b:2024
Published Date: 10/01/2024
Semiconductor devices – Part 15: Discrete devices – Isolated power semiconductor devices
$115.8
IEC 62258-2 Ed. 2.0 b:2011
Published Date: 05/25/2011
Semiconductor die products - Part 2: Exchange data formats
$125.1

Best-Selling Products