IEC 62047-14 Ed. 1.0 b:2012 PDF

IEC 62047-14 Ed. 1.0 b:2012 PDF

Name:
IEC 62047-14 Ed. 1.0 b:2012 PDF

Published Date:
02/28/2012

Status:
Active

Description:

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$43.5
Need Help?
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
Edition : 1.0
File Size : 1 file , 530 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 34
Published : 02/28/2012

History


Related products

IEC 60747-16-3 Ed. 1.0 b:2002
Published Date: 05/07/2002
Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
$83.4
IEC 62258-2 Ed. 2.0 b:2011
Published Date: 05/25/2011
Semiconductor die products - Part 2: Exchange data formats
$125.1
IEC 61967-2 Ed. 1.0 b:2005
Published Date: 09/29/2005
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
$57
IEC 62258-5 Ed. 1.0 b:2006
Published Date: 08/29/2006
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
$28.5

Best-Selling Products

CAN/CSA-ISO/IEC/IEEE 12207:18 (R2023)
Published Date: 12/01/2018
Systems and software engineering - Software life cycle processes (Adopted ISO/IEC 12207:2008, second edition, 2008-02-01)
$71.4
CAN/CSA-ISO/IEC/IEEE 12207-2:21
Published Date: 07/01/2021
Systems and software engineering - Software life cycle processes - Part 2: Relation and mapping between ISO/IEC/IEEE 12207:2017 and ISO/IEC 12207:2008 (ISO/IEC/IEEE 12207-2:2020, IDT)
$63.6
CAN/CSA-ISO/IEC/IEEE 14764:22
Published Date: 09/15/2022
Software engineering - Software life cycle processes - Maintenance (Adopted ISO/IEC/IEEE 14764:2022, third edition, 2022-01)
$51
CAN/CSA-ISO/IEC/IEEE 15026-1:20
Published Date: 03/01/2020
Systems and software engineering - Systems and software assurance - Part 1: Concepts and vocabulary (Adopted ISO/IEC 15026-1:2013, first edition, 2013-11-01)
$45
CAN/CSA-ISO/IEC/IEEE 15026-4:22
Published Date: 03/01/2022
Systems and software engineering - Systems and software assurance - Part 4: Assurance in the life cycle
$51.6
CAN/CSA-ISO/IEC/IEEE 15289:20
Published Date: 07/01/2020
Systems and software engineering - Content of life-cycle information items (documentation) (Adopted ISO/IEC/IEEE 15289:2019, fourth edition, 2019-07)
$60