IEC 62047-18 Ed. 1.0 b:2013 PDF

IEC 62047-18 Ed. 1.0 b:2013 PDF

Name:
IEC 62047-18 Ed. 1.0 b:2013 PDF

Published Date:
07/17/2013

Status:
Active

Description:

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$28.5
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IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
Edition : 1.0
File Size : 1 file , 550 KB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 26
Published : 07/17/2013

History


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