Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.
| Edition : | 1.0 |
| File Size : | 1
file
, 470 KB |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 25 |
| Published : | 08/15/2006 |
