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IEC 62137-1-3 Ed. 1.0 b:2008 PDF

IEC 62137-1-3 Ed. 1.0 b:2008 PDF

Name:
IEC 62137-1-3 Ed. 1.0 b:2008 PDF

Published Date:
11/27/2008

Status:
Active

Description:

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$57
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The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
Edition : 1.0
File Size : 1 file , 1.4 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 46
Published : 11/27/2008

History

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