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IEC 62148-21 Ed. 2.0 en:2021 PDF

IEC 62148-21 Ed. 2.0 en:2021 PDF

Name:
IEC 62148-21 Ed. 2.0 en:2021 PDF

Published Date:
04/22/2021

Status:
Active

Description:

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$28.5
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IEC 62148-21:2021 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.


Edition : 2.0
File Size : 1 file , 1.6 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 13
Published : 04/22/2021

History

IEC 62148-21 Ed. 2.0 en:2021
IEC 62148-21 Ed. 2.0 en:2021
Published Date: 04/22/2021
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$28.5
IEC 62148-21 Ed. 2.0 b:2021
IEC 62148-21 Ed. 2.0 b:2021
Published Date: 04/01/2021
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$28.5
IEC 62148-21 Ed. 1.0 b:2019
IEC 62148-21 Ed. 1.0 b:2019
Published Date: 03/11/2019
Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
$26.7

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