IEC 62453-302:2009(E) provides information for integrating the CIP technology into the FDT interface specification (IEC 62453-2). It specifies communication and other services. This specification neither contains the FDT specification nor modifies it. Communication Profile Family 2 (commonly known as CIP
TM1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, IEC 61158-6-2, and IEC 62026-3. The basic profiles CP 2/1 (ControlNet
TM2), CP 2/2 (EtherNet/IP
TM3), and CP 2/3 (DeviceNet
TM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet
TM1), also based on CIP
TM, is defined in [14].
This publication is to be read in conjunction with
IEC 62453-2:2009.
| Edition : | 1.0 |
| File Size : | 1
file
, 1.4 MB |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 32 |
| Published : | 06/30/2009 |
