IEC 62769-6 Ed. 3.0 b:2023 PDF

IEC 62769-6 Ed. 3.0 b:2023 PDF

Name:
IEC 62769-6 Ed. 3.0 b:2023 PDF

Published Date:
04/01/2023

Status:
Active

Description:

Field Device Integration (FDI) - Part 6: FDI Technology Mapping

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$7.5
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This part of IEC 62769 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®1) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.


Edition : 3.0
File Size : 1 file , 550 KB
ISBN(s) : 9782832264775
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 18
Published : 04/01/2023

History

IEC 62769-6 Ed. 3.0 b:2023
Published Date: 04/01/2023
Field Device Integration (FDI) - Part 6: FDI Technology Mapping
$7.5
IEC 62769-6 Ed. 2.0 b:2021
Published Date: 02/05/2021
Field Device Integration (FDI) - Part 6: FDI Technology Mapping
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