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IEC 62878-2-5 Ed. 1.0 b:2019 PDF

IEC 62878-2-5 Ed. 1.0 b:2019 PDF

Name:
IEC 62878-2-5 Ed. 1.0 b:2019 PDF

Published Date:
09/16/2019

Status:
Active

Description:

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

Publisher:
International Electrotechnical Commission

Document status:
Active
Format:
Electronic (PDF)
Delivery time:
10 minutes
Delivery time (for Russian version):
200 business days
SKU:
Choose Document Language:
$110.1
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IEC 62878-2-5 defines the data format for active and passive devices embedded inside an organic board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. This PAS describes the expression of 3D data information, the concept of layers, the structure of board data, and definitions of information repeatedly used in design.
Edition : 1.0
File Size : 1 file , 5.8 MB
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 112
Published : 09/16/2019

History

IEC 62878-2-5 Ed. 1.0 b:2019
IEC 62878-2-5 Ed. 1.0 b:2019
Published Date: 09/16/2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
$110.1
IEC 62878-2-5 Ed. 1.0 en:2019
IEC 62878-2-5 Ed. 1.0 en:2019
Published Date: 09/16/2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
$110.1

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