Name:
IEC 62899-202-9 Ed. 1.0 en:2023 PDF
Published Date:
08/01/2023
Status:
Active
Publisher:
International Electrotechnical Commission
This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
| Edition : | 1.0 |
| File Size : | 1 file , 670 KB |
| ISBN(s) : | 9782832273289 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 18 |
| Published : | 08/01/2023 |