IEC 63011-1 Ed. 1.0 b:2018 PDF

Name:
IEC 63011-1 Ed. 1.0 b:2018 PDF

Published Date:
11/28/2018

Status:
Active

Description:

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

Publisher:
International Electrotechnical Commission

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Edition :	1.0
File Size :	1 file , 1.3 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	24
Published :	11/28/2018

History

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Published Date: 10/01/1991

Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

$28.5