IEC 63011-3 Ed. 1.0 b:2018 PDF

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

Edition :	1.0
File Size :	1 file , 2.5 MB
Note :	This product is unavailable in Ukraine, Russia, Belarus
Number of Pages :	28
Published :	11/28/2018