Name:
IEC 63055 Ed. 2.0 en:2023 PDF
Published Date:
10/01/2023
Status:
Active
Publisher:
International Electrotechnical Commission
This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.
| Edition : | 2.0 |
| File Size : | 1 file , 9.8 MB |
| ISBN(s) : | 9782832275153 |
| Note : | This product is unavailable in Ukraine, Russia, Belarus |
| Number of Pages : | 298 |
| Published : | 10/01/2023 |
