IEC 63251 Ed. 1.0 b:2023 PDF

IEC 63251 Ed. 1.0 b:2023 PDF

Name:
IEC 63251 Ed. 1.0 b:2023 PDF

Published Date:
11/01/2023

Status:
Active

Description:

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Publisher:
International Electrotechnical Commission

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

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$57
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This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.


Edition : 1.0
File Size : 1 file , 4.7 MB
ISBN(s) : 9782832277508
Note : This product is unavailable in Ukraine, Russia, Belarus
Number of Pages : 46
Published : 11/01/2023

History


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